Organic thixotrope for use with adhesives and sealants at very low activation temperatures. Can be used with a broad range of solvents

Key Properties

· Provides viscosity control, thixotropy and excellent very thick layer sag resistance.
· Is seed-resistant and allows low temperature activation, - processing, and packaging.
· Is a cost effective 100 % active powder that is highly active at already low loading levels
· Has a broad compatibility to various solvents.
· Shows no intercoat adhesion problems when overcoated with a topcoat.